BGXP10S_X-ray linear sensor chips_Image Sensor Chips

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X-ray linear sensor chips-BGXP10S

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BGXP10S is a high-performance CMOS image sensor chip with advantages of high integration, high speed, high precision, high reliability and low-dose. With a pixel size of 100 µm, it supports 64-stage TDI operation.

Features:

· Pixel size of 100 µm
· Compatible with linear mode and HDR mode
· Maximum Line rate of 6.25 kHz with 64-stage TDI
· Maximum ADC resolution of 14bit
· Radiation-hardened design
· Flexible combination to achieve the required target size based on demand

Applications:

Industrial inspection
PCB inspection
Food inspection

Datasheet

Parameter

Parameter		Values	Unit
Active pixel array area		51.2 × 6.4	mm
Active pixel array		512(H) × 64(V)
Pixel size		100 × 100	um
Line rate		6.25K LPS (@64 stage)
Shutter		Rolling/Global shutter
Read noise		SLFW: 0.2 / LFW: 0.3 / HFW: 0.6 / SHFW: 1.2	Ke-
Dynamic range		69	dB
FWC		SLFW: 400Ke- / LFW: 700Ke- / HFW: 1.5Me- / SHFW: 3.7Me-
Radiation Hardness TID		50	KGy
Data Interface		LVDS/ IIC
Data Format		12bit/14bit RAW
Power supply	VDDIO	1.8~3.0	V
	VH	4.0
	VDDD_DIG	2.5~3.0
	VDDA_LDO	3.3
Power consumption		2.5	W
Size (LWH)		52 × 42 × 6	mm
Weight		0.1	kg
Temperature range		0~65①	℃
Packaging		COB
		① The temperature specified here refers to the Temperature range, not the ambient temperature.

Parameter	Parameter Value	Unit
Optical format	51.2mm x 6.4mm
Pixel size	200μm
Resolution	256H x 32V 128H x 16V
Frame rate	12500FPS/ 400kHz@1stage 25000FPS/ 400kHz@1stage
Data interface	LVDS

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