Setting sail with accolades to the global frontier! Having earned wide industry recognition at the recent Shenzhen Photonics Expo with its full range of new products and leading ECCD-TDI core imaging technology, BRIGATES has officially embarked on its globalization journey, making its debut at the VISION machine vision show in Stuttgart, Germany. Bringing hardcore new products such as deep-UV precision inspection and X-ray non-destructive testing to the overseas stage, BRIGATES showcases its domestically developed cutting-edge imaging solutions on the international industrial vision arena, setting a new benchmark for high-end precision inspection technology.

Hardcore Product Series I ➤

LCG Series New Model — Deep-UV ECCD-TDI Camera

The new LCG series deep-UV ECCD-TDI camera delivers an ultra-high line rate of 4 MHz and an exceptionally high dynamic range of over 80 dB. It enhances multiple core parameters for bright-field and dark-field precision inspection in semiconductor front-end processes, balancing low noise with deep-UV radiation hardness, fully meeting the stringent inspection demands of advanced process nodes and boosting the quality and speed of wafer optical inspection.

Key Forward-Looking Highlights:

・Ultimate performance parameters: maximum line rate 4 MHz, 266 nm UV quantum efficiency up to 70%, best readout noise as low as 7 e⁻, optimal dynamic range > 80 dB, with excellent imaging accuracy and image quality.

・Flexible operating-condition adaptation: offers 2K/4K configurations, supports multi-level integration adjustment and charge-domain Binning acceleration modes, suitable for various inspection scenarios.

・Harsh-environment adaptation: a 193 nm deep-UV radiation-hardened model will be introduced later.

・Efficient and stable transmission: equipped with a 200G high-speed CoF interface and built-in ISP image processing algorithms, with configurable 8/10/12-bit output precision, enabling high-speed, reliable imaging transmission under complex operating conditions.

Hardcore Product Series II ➤

LCP-HS Series — Deep-UV ECCD-TDI Camera

The LCP-HS series deep-UV TDI camera is built on BRIGATES' proprietary ECCD-TDI core technology. Leveraging its 5 µm fine pixels and 200G/400G ultra-high throughput advantage, it achieves all-around breakthroughs in high-speed, low-noise, and high-dynamic-range imaging, raising the ceiling of deep-UV inspection performance and meeting the ultimate precision inspection needs of high-end semiconductors.

Key Forward-Looking Highlights:

・Ultra-clear imaging power: equipped with 5 µm high-precision imaging pixels and 8K/16K ultra-high-resolution configurations to accurately capture microscopic defects. 

・Ultra-low-noise imaging: readout noise as low as 4 e⁻, greatly improving weak-defect identification and meeting high-end precision inspection needs.

・Hardcore photoelectric performance: QE up to 70% under 266 nm UV light; readout noise as low as 4 e⁻; full-well capacity 50 Ke⁻; single-array HDR delivers an ultra-high dynamic range of > 72 dB.

・High-precision quantization: built-in high-precision ADC supporting 12-bit high-precision quantization at 2 MHz full load.

・Ultra-Fast Data Transmission: Equipped with 200G/400G ultra-high-throughput CoF transmission interfaces, perfectly balancing high-resolution imaging and high-speed data processing to meet the extreme operating standards of high-end semiconductor equipment.

Hardcore Product Series III ➤

iEX Series X-ray TDI Line Detector

The all-new iEX series X-ray TDI line detector completes the non-destructive testing portfolio. Powered by proprietary ECCD-TDI charge-accumulation technology, it features an ultra-high line rate of 40 kHz and ultra-low noise, significantly improving imaging signal-to-noise ratio and overcoming the blur pain point of high-speed imaging. It is widely suitable for high-speed production-line inspection scenarios such as power batteries and non-destructive flaw detection.

Key Forward-Looking Highlights: High-speed imaging capability: maximum 40 kHz ultra-high line rate, perfectly suited for high-speed production-line dynamic inspection. Dual-spec pixel configuration: 48 µm (200-level integration) and 96 µm (100-level integration) options to meet different precision inspection needs. Ultimate imaging quality: readout noise as low as 32 e⁻, ultra-high sensitivity and ultra-wide dynamic range, with image quality far exceeding traditional digital TDI equipment. High-reliability operation: excellent radiation-hardening performance, enabling long-term stable operation in professional inspection scenarios.

Hardcore Product Series IV ➤

supX1512S X-ray CMOS Flat-Panel Detector

The supX1512S 2D CMOS X-ray flat-panel detector rounds out the X-ray imaging product matrix. Relying on unique radiation-hardening technology, it combines high DQE and high MTF imaging performance with both high resolution and high-speed output, easily handling medical imaging, industrial non-destructive testing, lithium battery, and semiconductor inspection scenarios.

Key Forward-Looking Highlights:

・Fine imaging foundation: 48 µm pixel size restores microscopic details and delivers excellent imaging resolution.

・High-speed data output: up to 60 fps data output at full resolution, meeting dynamic real-time inspection needs.

・Outstanding radiation resistance: irradiation lifetime up to 20000 Gy, suitable for high-intensity continuous-operation conditions.

・Excellent image performance: extremely low noise and ultra-wide dynamic range with minimal image latency and clear tonal gradation.

・Easy integration and deployment: compact structural design with high-speed network data interface, easily interfacing with various systems and adapting to complex working environments.

Deeply cultivating core imaging technology, BRIGATES heads to the international industrial vision stage. At this VISION show in Germany, BRIGATES will demonstrate live product test cases and customized imaging solutions on site, exchanging cutting-edge inspection know-how with global customers. We look forward to meeting you at the show to explore new opportunities in high-end imaging technology together.