The industry event is coming, and innovation is coming! The 2026 Shenzhen Photonics Expo is about to kick off. BRIGATES is building momentum with its new products, focusing on the core tracks of semiconductor high-end deep ultraviolet testing and industrial X-ray non-destructive testing. Based on the self-developed ECCD-TDI core technology platform, it brings new imaging solutions with all-round breakthroughs in line frequency, dynamic range, transmission bandwidth, and noise reduction capabilities.

Major Preview 1 ➤

LCG series new deep UV ECCD-TDI camera

The new deep UV ECCD-TDI camera of the LCG series features an ultra-high line frequency of 4MHz and an ultra-high dynamic range of over 80dB. A number of core parameters have been improved for semiconductor front-end bright and dark field precision inspection, taking into account low noise and deep ultraviolet radiation resistance performance, fully adapting to the strict inspection requirements of advanced processes, and helping to improve the quality and speed of wafer optical inspection.

Forward-looking core highlights:

• Ultimate performance parameters: maximum line frequency of 4MHz, 266nm ultraviolet quantum efficiency of 70%, optimal readout noise as low as 7e-, optimal dynamic range >70dB, accurate imaging and excellent image quality.

• Ultimate performance parameters: maximum line frequency of 4MHz, 266nm ultraviolet quantum efficiency of 70%, optimal readout noise as low as 7e-, optimal dynamic range >70dB, accurate imaging and excellent image quality.

• Ultimate performance parameters: maximum line frequency of 4MHz, 266nm ultraviolet quantum efficiency of 70%, optimal readout noise as low as 7e-, optimal dynamic range >70dB, accurate imaging and excellent image quality.

• Flexible working condition adaptation: Provides 2K/4K specifications, supports multi-level integral adjustment, charge domain Binning speed-up mode, and adapts to various detection scenarios.

• Flexible working condition adaptation: Provides 2K/4K specifications, supports multi-level integral adjustment, charge domain Binning speed-up mode, and adapts to various detection scenarios.

• Flexible working condition adaptation: Provides 2K/4K specifications, supports multi-level integral adjustment, charge domain Binning speed-up mode, and adapts to various detection scenarios.

• Harsh environment adaptation: A model with 193nm deep ultraviolet radiation reinforcement will be launched in the future.

• Harsh environment adaptation: A model with 193nm deep ultraviolet radiation reinforcement will be launched in the future.

• Harsh environment adaptation: A model with 193nm deep ultraviolet radiation reinforcement will be launched in the future.

• Efficient and stable transmission: Equipped with a 200G high-speed CoF interface, built-in ISP image processing algorithm, and configurable 8/10/12bit output accuracy, achieving high-speed and reliable imaging transmission under complex working conditions.

• Efficient and stable transmission: Equipped with a 200G high-speed CoF interface, built-in ISP image processing algorithm, and configurable 8/10/12bit output accuracy, achieving high-speed and reliable imaging transmission under complex working conditions.

• Efficient and stable transmission: Equipped with a 200G high-speed CoF interface, built-in ISP image processing algorithm, and configurable 8/10/12bit output accuracy, achieving high-speed and reliable imaging transmission under complex working conditions.

Major Preview 2 ➤

LCP-HS Series Deep UV ECCD-TDI Camera

The LCP-HS series deep UV TDI cameras are equipped with BRIGATES’ self-developed ECCD-TDI core technology. With the advantages of 5μm fine pixels and 200G/400G ultra-high throughput, it achieves all-round breakthroughs in high-speed, low-noise, and high-dynamic imaging, refreshes the upper limit of deep ultraviolet detection performance, and adapts to the extreme precision detection requirements of high-end semiconductors.

Forward-looking core highlights:

• Ultra-clear imaging capabilities: Equipped with 5um high-precision imaging pixels and equipped with 8K/16K ultra-high resolution configuration, it can accurately capture tiny defects.

• Ultra-clear imaging capabilities: Equipped with 5um high-precision imaging pixels and equipped with 8K/16K ultra-high resolution configuration, it can accurately capture tiny defects.

• Ultra-clear imaging capabilities: Equipped with 5um high-precision imaging pixels and equipped with 8K/16K ultra-high resolution configuration, it can accurately capture tiny defects.

• Ultra-low noise imaging: The readout noise is as low as 4e-, which greatly improves the ability to identify weak defects and meets the needs of high-end precision inspection.

• Ultra-low noise imaging: The readout noise is as low as 4e-, which greatly improves the ability to identify weak defects and meets the needs of high-end precision inspection.

• Ultra-low noise imaging: The readout noise is as low as 4e-, which greatly improves the ability to identify weak defects and meets the needs of high-end precision inspection.

• Hard-core optoelectronic performance: QE reaches 70% under 266nm UV light; readout noise as low as 4e-; full well capacity 50Ke⁻; single-array HDR brings >72dB ultra-high dynamic range

• Hard-core optoelectronic performance: QE reaches 70% under 266nm UV light; readout noise as low as 4e-; full well capacity 50Ke⁻; single-array HDR brings >72dB ultra-high dynamic range

• Hard-core optoelectronic performance: QE reaches 70% under 266nm UV light; readout noise as low as 4e-; full well capacity 50Ke⁻; single-array HDR brings >72dB ultra-high dynamic range

• High-precision quantization: built-in high-precision ADC, supports 12-bit high-precision quantization under 2MHz full load (12/10/8bit can be flexibly switched).

• High-precision quantization: built-in high-precision ADC, supports 12-bit high-precision quantization under 2MHz full load (12/10/8bit can be flexibly switched).

• High-precision quantization: built-in high-precision ADC, supports 12-bit high-precision quantization under 2MHz full load (12/10/8bit can be flexibly switched).

• Extremely fast data transmission: Equipped with 200G/400G ultra-high-throughput CoF transmission interface, it perfectly balances high-resolution imaging and high-speed data processing, meeting the extreme usage standards of high-end semiconductor equipment.

• Extremely fast data transmission: Equipped with 200G/400G ultra-high-throughput CoF transmission interface, it perfectly balances high-resolution imaging and high-speed data processing, meeting the extreme usage standards of high-end semiconductor equipment.

• Extremely fast data transmission: Equipped with 200G/400G ultra-high-throughput CoF transmission interface, it perfectly balances high-resolution imaging and high-speed data processing, meeting the extreme usage standards of high-end semiconductor equipment.

Major Preview three ➤

iEX series X-ray TDI linear array detector

The new iEX series X-ray TDI linear array detectors complement the non-destructive testing landscape. Equipped with self-developed ECCD-TDI charge superposition technology, it has the advantages of 40kHz ultra-high line frequency and ultra-low noise, which significantly improves the imaging signal-to-noise ratio and solves the blurring pain points of high-speed imaging. It can be widely adapted to high-speed assembly line inspection scenarios such as power batteries and non-destructive testing.

Forward-looking core highlights:

• High-speed imaging capability: up to 40kHz ultra-high line frequency, perfect for high-speed pipeline dynamic detection

• High-speed imaging capability: up to 40kHz ultra-high line frequency, perfect for high-speed pipeline dynamic detection

• High-speed imaging capability: up to 40kHz ultra-high line frequency, perfect for high-speed pipeline dynamic detection

• Dual specification pixel configuration: 48μm (200-level integration), 96μm (100-level integration) optional, adapting to different precision detection needs

• Dual specification pixel configuration: 48μm (200-level integration), 96μm (100-level integration) optional, adapting to different precision detection needs

• Dual specification pixel configuration: 48μm (200-level integration), 96μm (100-level integration) optional, adapting to different precision detection needs

• Ultimate imaging quality: readout noise as low as 32e⁻, ultra-high sensitivity, ultra-wide dynamic range, imaging quality far exceeding traditional digital TDI equipment

• Ultimate imaging quality: readout noise as low as 32e⁻, ultra-high sensitivity, ultra-wide dynamic range, imaging quality far exceeding traditional digital TDI equipment

• Ultimate imaging quality: readout noise as low as 32e⁻, ultra-high sensitivity, ultra-wide dynamic range, imaging quality far exceeding traditional digital TDI equipment

• Highly reliable working conditions: It has excellent radiation reinforcement performance and can operate stably in professional testing scenarios for a long time.

• Highly reliable working conditions: It has excellent radiation reinforcement performance and can operate stably in professional testing scenarios for a long time.

• Highly reliable working conditions: It has excellent radiation reinforcement performance and can operate stably in professional testing scenarios for a long time.

Major Preview 4 ➤

supX1512P X-ray CMOS flat panel detector

The supX1512P two-dimensional CMOS X-ray flat panel detector completes the X-ray imaging product matrix. Relying on unique anti-radiation technology, it has high DQE and high MTF imaging performance, taking into account high resolution and high-speed output capabilities, and can easily handle various inspection scenarios of medical imaging, industrial non-destructive, lithium battery and semiconductor.

Forward-looking core highlights:

• Fine imaging substrate: 48μm pixel size restores microscopic details and achieves excellent imaging resolution

• Fine imaging substrate: 48μm pixel size restores microscopic details and achieves excellent imaging resolution

• Fine imaging substrate: 48μm pixel size restores microscopic details and achieves excellent imaging resolution

• High-speed data output: up to 60fps data output at full resolution to meet dynamic real-time detection needs

• High-speed data output: up to 60fps data output at full resolution to meet dynamic real-time detection needs

• High-speed data output: up to 60fps data output at full resolution to meet dynamic real-time detection needs

• Outstanding radiation resistance: radiation life up to 20,000Gy, suitable for high-intensity continuous working conditions

• Outstanding radiation resistance: radiation life up to 20,000Gy, suitable for high-intensity continuous working conditions

• Outstanding radiation resistance: radiation life up to 20,000Gy, suitable for high-intensity continuous working conditions

• Excellent image performance: extremely low noise, ultra-wide dynamic range, small image delay, and clear imaging levels

• Excellent image performance: extremely low noise, ultra-wide dynamic range, small image delay, and clear imaging levels

• Excellent image performance: extremely low noise, ultra-wide dynamic range, small image delay, and clear imaging levels

• Convenient integrated deployment: compact structure design, equipped with high-speed network data interface, easy to connect to various systems, adapt to complex working environment

• Convenient integrated deployment: compact structure design, equipped with high-speed network data interface, easy to connect to various systems, adapt to complex working environment

• Convenient integrated deployment: compact structure design, equipped with high-speed network data interface, easy to connect to various systems, adapt to complex working environment

The event is coming, so stay tuned. At the 2026 Shenzhen Photonics Expo, we will unlock more new product details, technical solutions and actual test cases. See you at the A56 BRIGATES booth in Hall 6 of the Shenzhen International Convention and Exhibition Center on September 9th!