From August 31st to September 2nd, the 2026 CSEAC Wuxi Semiconductor Equipment Materials and Core Components Exhibition officially kicked off. BRIGATES participated in the exhibition with two new iteratively upgraded deep ultraviolet TDI industrial cameras. Facing the field of semiconductor front-end optical inspection, it showcased the latest scientific research results of its self-developed imaging technology platform, exported a complete set of localized high-end ultraviolet imaging solutions, and actively empowered the high-quality development of the semiconductor inspection industry chain.

As an authoritative professional exhibition in the field of domestic semiconductor equipment parts, CSEAC gathers high-quality resources from the upstream and downstream of the industry chain, focusing on key areas such as wafer manufacturing, precision defect detection, and core components, to build an efficient platform for technical exchanges and business docking. At present, the localization process of semiconductors continues to accelerate, and front-end precision ultraviolet detection and imaging devices have become the key to industrial upgrading. BRIGATES Micro has deeply cultivated the core imaging technology of ECCD-TDI, continuously optimized the optoelectronic performance, and accurately overcome the technical problems of semiconductor light and dark field detection.

The two deep ultraviolet TDI cameras exhibited at this exhibition have completed a number of key performance upgrades. Among them, the 4MHz ultra-high line frequency deep ultraviolet ECCD-TDI camera is an industry benchmark product. It is available in 2K and 4K specifications and supports multi-level integral adjustment and charge domain Binning speed-up mode. The maximum line frequency of the product can reach 4MHz, the ultraviolet quantum efficiency in the 266nm band reaches 70%, the optimal readout noise is as low as 7e⁻, and an ultra-high dynamic range of more than 70dB is achieved; this series of cameras will subsequently launch 193nm deep ultraviolet irradiation The ruggedized model is suitable for harsh photolithography inspection conditions. It is equipped with a 200G high-speed Cof data interface and a built-in ISP image processing algorithm. It can flexibly switch to 8-12bit image output accuracy to ensure stable and efficient image transmission under complex working conditions.

Another 2MHz high-speed deep ultraviolet TDI camera is equipped with 5μm imaging pixels, providing 8K ultra-high resolution configuration; the readout noise is as low as 4e⁻, and equipped with a 200G ultra-high-throughput CoF transmission interface, which combines high-resolution imaging and high-speed data throughput, and can meet the extreme usage standards of high-end semiconductor precision inspection equipment.

During the exhibition, many semiconductor equipment manufacturers and industry chain partners visited the booth for on-site exchanges and negotiations, providing customized imaging solutions based on different production line inspection needs, and conducting in-depth communication on product support, project implementation, long-term strategic cooperation, etc., and gained high recognition and cooperation intentions from many industry customers.

On-site communication at the exhibition, professional answers

The interaction at the exhibition was enthusiastic

Chen Ju, deputy general manager of the company, presented awards to the winners

Photos of award-winning guests at the booth

In the future, BRIGATES will continue to consolidate the advantages of its independent core technology platform. Based on core application fields such as scientific imaging, industrial testing, and medical imaging, BRIGATES will delve into the core technology of optoelectronic imaging, make up for the shortcomings of optoelectronic imaging hardware, and use reliable domestic core components to promote the high-quality development of domestic semiconductor testing equipment and high-end imaging industries, accelerating the realization of independent control of the entire industry chain.