BRIGATES

Juli TGV glass packaging

BRIGATES was invited to participate in the 2nd Glass Substrate and TGV Technology Conference

Conference frontier

On July 3, 2026, the second Glass Substrate and TGV Technology Conference was held in Hefei. BRIGATES was invited to participate as a supporting unit to deeply connect with the upstream and downstream resources of the entire advanced packaging industry chain. With its full spectrum of visible light, ultraviolet, and X-ray imaging core strengths and complete localized alternative solutions, it has gained focus and cooperation negotiations from semiconductor equipment integrators, terminal manufacturing companies, and industry technical experts.

01 [Exhibition background and BRIGATES micro positioning]

This conference focuses on the industrialization of cutting-edge technologies for glass substrates and TGV glass vias, on breakthroughs in advanced packaging technology and the construction of local supply chains, bringing together industry experts, industry chain leaders and terminal manufacturers to create a professional vertical communication and docking platform. Currently, Moore's Law is approaching the physical limit, TGV technology has become the core direction of advanced packaging upgrades, and the industry's demand for high-speed surface inspection and internal non-destructive testing has surged. Relying on the core capabilities of self-developed imaging chips, BRIGATES Micro has created a full-spectrum detection product matrix of visible light, ultraviolet, and X-rays, which is fully adapted to the full-process detection of glass substrates, wafers, and masks, and its performance benchmarks and surpasses overseas brands.

02【Core Exhibits】

01. UV/visible TDI camera

Up to 3M ultra-high line frequency, covering 266nm and 355nm core UV bands, 1024-level TDI superposition is suitable for high-speed bright and dark field inspection of wafers under dark light.

02. supX1512U X-ray flat panel detector

48μm high-precision pixels, 88dB hardware wide dynamic range, and 20,000Gy ultra-high radiation tolerance are suitable for CT inspection of substrate micro-defects and high-intensity continuous operations in factories, empowering advanced packaging inspection.

03. X-ray TDI linear array detector

Realize online detection, non-destructive testing, adapt to precision castings, pole piece coating closed-loop testing, and reduce the cost of using radiographic equipment.

03

[Technical strength and market recognition]

Relying on the full technical layout of surface imaging X-ray penetration testing to form differentiated advantages, it accurately matches the rigid needs of the industry, attracting many corporate technical leaders to discuss customized testing cooperation; industry experts have an in-depth understanding of the technical parameters, mass production delivery capabilities and next-generation chip R&D plans of BRIGATES Micro's full range of imaging products on site, and highly recognize the company's technical route to benchmark overseas high-end brands and achieve localized replacement of the entire range of imaging equipment.

04

【Future Outlook】

In the future, BRIGATES Micro will continue to rely on multiple core technologies such as pixel design, circuit research and development, radiation resistance, and system integration to create high-end imaging products with high sensitivity, high frame rate, high dynamics, and resistance to strong radiation. It will link up with the industrial chain to tackle core detection technologies, build a local semiconductor supply chain with localized imaging solutions, and empower the high-quality development of the industry.