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Sensor Chip Customization
Design Service Capabilities
  • Experienced image sensor design team

  • Professional support team

  • Nationwide supply chain capabilities

Product Feature Solutions

High-speed TDI-ECCD

High-sensitivity low-noise sensors

High dynamic range sensors

High-speed array/linear sensors

Deep UV sensors

Radiation-resistant image sensors

Various X-ray detectors

Hyperspectral and multispectral sensor technology

Optical stitching technology (enabling wafer-level sensor design)

Optoelectronic detector readout circuits (infrared, X-ray)

Custom Chip Development Process
Customized Solutions

No.

Customized Features

Type

1

Multispectral ultra-high resolution remote sensing

ECCD TDI linear array remote sensing

2

Multispectral ultra-high resolution remote sensing

ECCD TDI linear array remote sensing

3

Ultra-high resolution, global exposure,
large target remote sensing

CMOS array global exposure image sensor

4

Ultra-high resolution, high sensitivity,
large target remote sensing

CMOS array image sensor

5

Radiation-resistant chip

(TID > 1M Gray)

CMOS array image sensor

6

High frame rate, high spectral

Global shutter CMOS image sensor

7

Multispectral super-resolution structure

ECCD TDI linear array remote sensing

8

IntegratedWiegand sensor, low-light performance,
near-infrared performance

CMOS digital image sensor

9

High sensitivity and high dynamic range,
low-light performance, near-infrared performance

CMOS linear array image sensor

10

High-resistivity substrate, PD trench etch process

CMOS array image sensor

11

Multi-image accumulation averaging, single power supply,
soft sleep mode, built-in frame buffer

CMOS fingerprint sensor

12

High frame rate, encoded output,
high sensitivity and dynamic range pixels,
3-side stitchable

High-performance CT sensor

13

High sensitivity, linear/HDR compatible,
radiation-resistant reinforced

Intraoral dental detector

Industrial small-size flat panel detector

14

Ultra high-speed

Ultra-high-speed image sensor

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