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X-ray linear sensor chips-BGXP09S
BGXP09S is a high-performance CMOS image sensor chip with advantages of high integration, high speed, high precision, high reliability and low-dose. With a pixel size of 200 µm, it supports four-line TDI operation.
Features:
· Pixel size of 200 µm
· Compatible with linear mode and HDR mode
· Maximum Line rate of 60 kHz
· Maximum ADC resolution of 14bit
· Radiation-hardened design
· Flexible combination to achieve the required target size based on demand
Applications:
Industrial inspection
PCB inspection
Food inspection
Parameter
Parameter Values Unit
Active pixel array area 51.2 × 0.8 mm
Active pixel array 256(H) × 4(V)
Pixel size 200 × 200 um
Line rate 60KHz/Lines
Shutter Rolling/Global shutter
Read noise 300 e-
Dynamic range 85 dB
FWC 5.5 Me-
Radiation Hardness TID 50 KGy
Data Interface LVDS/IIC
Data Format 14bit RAW
Power supply VDDIO 1.8~3.0 V
VH 4.0
VDDD 2.5~3.0
VDDA_LDO 3.3
Power consumption 2.5 W
Size (L*W*H) 52 × 20 × 6 mm
Weight 0.1 kg
Temperature range 0~65 ①
Packaging COB
① The temperature specified here refers to the Temperature range, not the ambient temperature.
QE Curve
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