BGXP03_X-ray array sensor chips_Image Sensor Chips

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X-ray array sensor chips-BGXP03

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BGXP03 is two-dimensional CMOS image sensor designed for X-ray flat panel detector, which requires high resolution, low noise, large area and wide dynamic range. Based on BGM’ s excellent radiation-hard design and unique ADC-integrated scheme, the BGXP03 offers the highest technical performance and easy to be integrated.

Features:

· Small pixel pitch
· ADC-integrated scheme
· Low noise
· Wide dynamic range
· Radiation-hard
· Stable offset calibration
· Low power consumption

Applications:

Medical (Especially suitable for mammography )
Crystallography
Non-destructive testing

Datasheet

Parameter

Parameter		Values	Unit
Active pixel array area		115.20 × 147.45	mm
Active pixel array		2400(H) × 3072(V)
Pixel size		48 × 48	um
Frame rate		14bit 15 / 12bit 30	fps
Shutter		rolling
Read noise		50@SFDmode / 300@LFDmode	e-
Dynamic range		72(linear mode) / 88(HDR mode)	dB
FWC		1.2	Me
Dark current@25℃		1100	e-/s
Radiation Hardness TID		20	kGy
Output interface		LVDS
Dosage sensing		Supports Full Field of View DS
Data Format		12bit/14bit RAW
Power supply	VDDD	2.5~3.3	V
	VDDIO	1.8~3.3
	VLDOIN	4.2
Power consumption		2.0@15 fps full frame readout	W
Temperature range		0~65①	℃
Control interface		IIC
		① The temperature mentioned here refers to the chip temperature, so the board design must pay attention to heat dissipation.

Parameter	Parameter Value	Unit
Optical format	115.2mm x 146.4mm
Pixel size	48um
Resolution	2400H x 3050V
Frame rate	30fps@12bit
Data interface	LVDS

QE Curve